ASE Technology Holding Co., Ltd. (NYSE:ASX) is set to announce third quarter earning results on Friday 30th October 2020, after market close.
Analysts surveyed by Thomson Reuters are predicting, ASX to report 3Q20 income of $ 0.09 per share.
For the full year, analysts anticipate top line of $ 15258.80 million, while looking forward to income of $ 0.34 per share bottom line.
Previous Quarter Performance
ASE Technology Holding Co., Ltd. unwinded income for the second quarter of $ 0.11 per share, from the revenue of $ 3,592.00 million. The quarterly earnings swell 175.00 percent while revenues developed 23.10 percent compared with the same quarter last year.
Wall street analysts are predicting, ASX to report 2Q20 income of $ 0.08 per share from revenue of $ 3470.02 million. The bottom line results beat street analysts by $ 0.03 or 37.50 percent, at the same time, top line results outshined analysts by $ 121.98 million or 3.52 percent.
Stock Performance
Shares of ASE Technology Holding Co., Ltd. traded up $ 0.11 or 2.58 percent on Thursday, reaching $ 4.38 with volume of 585.40 thousand shares. ASE Technology Holding Co., Ltd. has traded high as $ 4.39 and has cracked $ 4.28 on the downward trend
According to the previous trading day, closing price of $ 4.38, representing a 34.70 % increase from the 52 week low of $ 3.17 and a 25.09 % decrease over the 52 week high of $ 5.70.
The company has a market capital of $ 9.64 billion and is part of the Technology sector and Semiconductors industry.
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services (EMS) in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip-chip ball grid array (BGA), flip-chip chip scale package (fcCSP), advanced chip scale packages (aCSP), quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper and silver wire bonding solutions, as well as module-based solutions.
