PDF Solutions, Inc. (NASDAQ:PDFS) is set to announce third quarter earning results on Thursday 5th November 2020, after market close.
Analysts surveyed by Thomson Reuters are predicting, PDFS to report 3Q20 income of $ 0.03 per share.
For the full year, analysts anticipate top line of $ 89.52 million, while looking forward to income of $ 0.12 per share bottom line.
Previous Quarter Performance
PDF Solutions, Inc. recorded income for the second quarter of $ 0.01 per share, from the revenue of $ 21.41 million. The quarterly earnings down 66.67 percent while revenues elevated 4.08 percent compared with the same quarter last year.
According to street consensus, PDFS was expected to report 2Q20 income of $ 0.03 per share from revenue of $ 22.38 million. The bottom line results missed street analysts by $ 0.02 or 66.67 percent, at the same time, top line results fell short of analysts by $ 0.97 million or 4.33 percent.
Stock Performance
Shares of PDF Solutions, Inc. traded up $ 0.58 or 2.95 percent on Wednesday, reaching $ 20.27 with volume of 82.90 thousand shares. PDF Solutions, Inc. has traded high as $ 20.32 and has cracked $ 19.56 on the downward trend
The closing price of $ 20.27, representing a 128.69 % increase from the 52 week low of $ 8.61 and a 25.47 % decrease over the 52 week high of $ 26.42.
The company has a market capital of $ 740.29 million and is part of the Technology sector and Software – Application industry.
Conference Call
PDF Solutions, Inc. will be hosting a conference call at 5:00 PM eastern time on 5th November 2020, to discuss its 3Q20 financial results with the investment community. A live webcast with presentations will be available on the Internet by visiting the Company website www.pdf.com
PDF Solutions, Inc. provides hardware, software, and intellectual property products to integrated circuit (IC) vendors in the United States, China, Taiwan, Germany, and internationally. It offers Exensio platform, which consists of Exensio-Yield that collects and stores yield data in an analysis-ready database, which enables product engineers to identify and analyze production yield, performance, reliability, and other issues; Exensio-Control, which provides fault detection and classification capabilities for monitoring, alarming, and controlling manufacturing tool sets; Exensio-Test that offers data collection and analysis capability; Exensio Characterization, which encapsulates test structure analysis functionality of electrical and in-line inspection data from CV test chips and design-for-inspection DFI on-chip instruments; and Exensio ALPS that provides device manufacturers with the capability to link all device data, including fabrication and characterization data from every step of the product life cycle.
