Cabot Microelectronics Corporation (NASDAQ:CCMP) is reporting fourth quarter earnings results on Wednesday 11th November 2020, after market close.
The consensus estimates from Thomson Reuters are income of $ 1.70 per share.
For the full year, analysts predict revenues of $ 1124.97 million, while looking forward to income of $ 7.18 per share.
Previous Quarter Performance
Cabot Microelectronics Corporation communicated income for the third quarter of $ 1.80 per share, from the revenue of $ 274.73 million. According to street consensus, CCMP was expected to report 3Q20 income of $ 1.54 per share from revenue of $ 272.10 million. The bottom line results beat street analysts by $ 0.26 or 16.88 percent, at the same time, top line results outshined analysts by $ 2.63 million or 0.97 percent.
Stock Performance
Shares of Cabot Microelectronics Corporation traded up $ 0.35 or 0.21 percent on Tuesday, reaching $ 168.75 with volume of 182.40 thousand shares. Cabot Microelectronics Corporation has traded high as $ 170.54 and has cracked $ 167.12 on the downward trend
The closing price of $ 168.75, representing a 97.51 % increase from the 52 week low of $ 85.26 and a 3.7 % decrease over the 52 week high of $ 174.87.
The company has a market capital of $ 4.90 billion and is part of the Technology sector and Semiconductor Equipment & Materials industry.
Conference Call
Cabot Microelectronics Corporation will be hosting a conference call at 10:00 AM eastern time on 11th November 2020, to discuss its 4Q20 financial results with the investment community. A live webcast with presentations will be available on the Internet by visiting the Company website www.cabotcmp.com
Cabot Microelectronics Corporation, together with its subsidiaries, develops, manufactures, and sells polishing slurries and pads used in the manufacture of advanced integrated circuit (IC) devices in the semiconductor industry in chemical mechanical planarization (CMP) process. It provides CMP slurries, which are liquid solutions composed of high-purity deionized water, proprietary chemical additives, and engineered abrasives that chemically and mechanically interact with the surface material of the IC device at an atomic level; and CMP pads that are engineered polymeric materials designed to distribute and transport the slurry to the surface of the wafer and distribute it evenly across the wafer. The companys CMP slurries are used for polishing various materials that conduct electrical signals, including tungsten, copper, tantalum, and aluminum; and various materials that are used in the production of rigid disks and magnetic heads for hard disk drives, as well as used in the dielectric insulating materials that separate conductive layers within logic and memory IC devices.
