Amkor Technology, Inc. (NASDAQ:AMKR) outsourced semiconductor packaging provider, is expected to report third quarter earnings results, after market close, on Monday 26th October 2020.
Analysts polled by Thomson Reuters anticipate third quarter income of $ 0.26 per share.
Looking ahead, the full year income are expected at $ 1.01 per share on the revenues of $ 4802.59 million.
The Company Outlook
Earnings for 3Q20 are anticipated in a range of $ 0.17 ~ $ 0.35 per share, while revenues are expected in a range of $ 1,200.00 million ~ $ 1,300.00 million
Click Here For More Historical Outlooks Of Amkor Technology, Inc.
Previous Quarter Performance
Amkor Technology, Inc. unwinded income for the second quarter of $ 0.23 per share, from the revenue of $ 1,173.00 million. The quarterly revenues increased 31.02 percent compared with the same quarter last year. Wall street analysts are predicting, AMKR to report 2Q20 loss of $ 0.03 per share from revenue of $ 1050.40 million. The top line results outshined analysts by $ 122.60 million or 11.67 percent.
Stock Performance
On Friday, shares of Amkor Technology, Inc. has traded high as $ 13.33 and has cracked $ 12.97 on the downward trend, reaching $ 13.28 with volume of 1.26 million shares.
According to the previous trading day, closing price of $ 13.28, representing a 142.78 % increase from the 52 week low of $ 5.40 and a 17.03 % decrease over the 52 week high of $ 15.80.
The company has a market capital of $ 3.21 billion and is part of the Technology sector and Semiconductors industry.
Recent Analyst recommendations
- On 14th September 2020, upgraded by Credit Suisse Group to Outperform from Neutral rating.
Conference Call
Amkor Technology, Inc. will be hosting a conference call at 5:00 PM eastern time on 26th October 2020, to discuss its 3Q20 financial results with the investment community. A live webcast with presentations will be available on the Internet by visiting the Company website www.amkor.com
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer back-grinds, package design, packaging, and test and drop shipment services.
